Cooling process for vacuum processing plant for applying and/or removing layer of glass plate, comprises verifying operating conditions of heat sources and pumps of the plants and carrying out buffer cooing and rinsing cooling of the plant

The cooling process comprises verifying operating conditions of heat sources and pumps of the plants, during which the heat sources and pumps are optionally switched off or detached, supplying a cooling gas into the plants up to a first target pressure (100-900 mbar), (buffer cooling), where the tem...

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Bibliographische Detailangaben
Hauptverfasser: BAUER, REINHARDT, MOSSHAMMER, STEFFEN, YALE, WILLIAM ALLEN, OSTHEIMER, STEFFEN
Format: Patent
Sprache:eng ; ger
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Zusammenfassung:The cooling process comprises verifying operating conditions of heat sources and pumps of the plants, during which the heat sources and pumps are optionally switched off or detached, supplying a cooling gas into the plants up to a first target pressure (100-900 mbar), (buffer cooling), where the temperature of the cooling gas is determined and compared with a first target temperature (70-120 [deg] C), and then the cooling gas is removed from the plants when the measured temperature is equal to the first target temperature, and rinsing the vacuum processing unit using the cooling gas. The cooling process comprises verifying operating conditions of heat sources and pumps of the plants, during which the heat sources and pumps are optionally switched off or detached, supplying a cooling gas into the plants up to a first target pressure (100-900 mbar), (buffer cooling), where the temperature of the cooling gas is determined and compared with a first target temperature (70-120[deg] C), and then the cooling gas is removed from the plants when the measured temperature is equal to the first target temperature, and rinsing the vacuum processing unit by simultaneous bringing in and bringing out of the cooling gas with a second target pressure (100-900 mbar) (rinsing cooling), where the temperature of the cooling gas is measured during evacuating the vacuum processing unit and is compared with a second target temperature (70-120 [deg] C) as well as the rinsing is finished, when the measured temperature is equal to the second target temperature. The buffer cooling process is carried out twice before the rinsing cooling process. The first target pressure with each repetition of the buffer cooling is chosen higher than the previous buffer cooling. The second target pressure is increased during the rinsing cooling. The temperature of the cooling gas at or in a gas outlet the vacuum processing unit is determined and the cooling gas is introduced at a wall of the vacuum processing unit, where the wall faces the gas outlet. Die Erfindung betrifft ein Schnellkühlverfahren für Vakuumprozessanlagen, umfassend: - Prüfen des Betriebszustandes aller Wärmequellen und Pumpen der Vakuumprozessanlage, gegebenenfalls Abschalten oder Abtrennen aller in Betrieb befindlichen Wärmequellen und Pumpen der Vakuumprozessanlage; - Einlassen eines Kühlgases in die Vakuumprozessanlage bis zu einem vorgebbaren ersten Solldruck, Ermittlung der Temperatur des Kühlgases und Vergleich der ermittelten