Coating semiconductor wafer in coating system, comprises coating the wafers within functional area, and placing individual wafers in two rows next to each other and in two rows one behind other directly on conveyor belt of transport device

The method comprises coating the semiconductor wafers within a functional area, placing the individual semiconductor wafers in two rows next to each other and in two rows one behind the other directly onto a conveyor belt of a transport device, and transporting the individual wafers into a coating system on the conveyor belt through the functional area and transporting out the individual wafers from the coating system, where the semiconductor wafers within the coating system is transferred from a previous transport device directly to the conveyor belt of a subsequent transport device. The method comprises coating the semiconductor wafers within a functional area, placing the individual semiconductor wafers in two rows next to each other and in two rows one behind the other directly onto a conveyor belt of a transport device, and transporting the individual semiconductor wafers into a coating system on the conveyor belt through the functional area and transporting out the individual semiconductor wafers from the coating system, where the semiconductor wafers within the coating system is transferred at a point from a previous transport device by its conveyor belt directly to the conveyor belt of a subsequent transport device. The previous transport device and/or the subsequent transport device are temporarily moved from an operating position into a transfer position for transferring the semiconductor wafers. The distance between the previous transport device and the subsequent transport device in the transfer position is smaller than in the operating position. Before moving the previous transport device and/or the subsequent transport device, a vacuum valve (6) arranged between the previous transport device and the subsequent transport device is opened. The upper strand and the lower strand of the endless conveyor belt are guided to a transport device through respective compartments, which are separately evacuatable from each other. The conveyor belt of the transport device is moved to an unwinding roller by rewinding from the unwinding roller, and is cleaned at a location of adhesion condensate. An independent claim is included for a coating system. Es wird ein Verfahren zur Beschichtung von Halbleiterscheiben vorgeschlagen, bei dem die Halbleiterscheiben innerhalb mindestens eines Funktionsbereichs beschichtet werden, wobei einzelne Halbleiterscheiben in mindestens zwei Reihen nebeneinander und in mindestens zwei Reihen hintereinander direkt auf ein Förder