Power semiconductor module, has heat conductive paste layer that is provided with number of bars spaced along longitudinal central line of module, where bars are tapered from longitudinal central line at both ends

The module (2) has a heat conductive paste layer (6) arranged on a side of a module base plate (8), where the side is turned away from the module. The layer includes a number of bars spaced along a longitudinal central line of the module, where the bars are tapered from the longitudinal central line...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WORMUTH, DIRK, GUCKENBERGER, HERBERT
Format:	Patent
Sprache:	eng ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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