Power semiconductor module, has heat conductive paste layer that is provided with number of bars spaced along longitudinal central line of module, where bars are tapered from longitudinal central line at both ends

Power semiconductor module, has heat conductive paste layer that is provided with number of bars spaced along longitudinal central line of module, where bars are tapered from longitudinal central line at both ends

The module (2) has a heat conductive paste layer (6) arranged on a side of a module base plate (8), where the side is turned away from the module. The layer includes a number of bars spaced along a longitudinal central line of the module, where the bars are tapered from the longitudinal central line...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: WORMUTH, DIRK, GUCKENBERGER, HERBERT
Format: Patent
Sprache:eng ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:The module (2) has a heat conductive paste layer (6) arranged on a side of a module base plate (8), where the side is turned away from the module. The layer includes a number of bars spaced along a longitudinal central line of the module, where the bars are tapered from the longitudinal central line at both ends. The bars are dimensioned with respect to length such that the base plate comprises a non-treated surface region. The bars are divided into a number of spaced surface elements. The base plate is made of ceramic or copper.