Sensor for use as e.g. differential pressure sensor, has housing in which sensor element and electronic component are accommodated, and electrical connection supported on base plate of housing by support

The sensor has a housing (10) in which a sensor element (16) and an electronic component (18) i.e. application-specific integrated circuit (ASIC), are accommodated. An electrical connection (20) runs between the sensor element and the electronic component. The electrical connection is supported on a...

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Bibliographische Detailangaben
Hauptverfasser:	KADEN, THOMAS, SCHOLZEN, HOLGER
Format:	Patent
Sprache:	eng ; ger
Schlagworte:	ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS MEASURING MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR PHYSICS TARIFF METERING APPARATUS TESTING
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Beschreibung
Zusammenfassung:	The sensor has a housing (10) in which a sensor element (16) and an electronic component (18) i.e. application-specific integrated circuit (ASIC), are accommodated. An electrical connection (20) runs between the sensor element and the electronic component. The electrical connection is supported on a base plate (12) of the housing by a support (24). The electrical connection has a bonding wire (22) that is connected with the support on bonding locations. An adhesive seals a housing cover and the baseplate against each other.