Laser processing a substrate by a laser processing head along a first processing path, comprises deflecting laser beams on the substrate at a focal point, and determining position of the respective focal points for further processing paths
The method for laser processing a substrate (1) by a laser processing head (2) along a first processing path, comprises deflecting laser beams on the substrate at a focal point (6), determining the position of the respective focal points for further processing paths to be consecutively introduced in...
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Sprache: | eng ; ger |
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Zusammenfassung: | The method for laser processing a substrate (1) by a laser processing head (2) along a first processing path, comprises deflecting laser beams on the substrate at a focal point (6), determining the position of the respective focal points for further processing paths to be consecutively introduced in dependent of a possible deviation, and determining a corresponding correction value for all the further processing paths based on the deviation of an individual previous processing path from an assigned reference path (5) detected using a sensor. The method for laser processing a substrate (1) by a laser processing head (2) along a first processing path, comprises deflecting laser beams on the substrate at a focal point (6), determining the position of the respective focal points for further processing paths to be consecutively introduced in dependent of a possible deviation, and determining a corresponding correction value for all the further processing paths based on the deviation of an individual previous processing path from an assigned reference path (5) detected using a sensor, so that the correction value of the focal point is simultaneously used as correction value for all the focal points during the introduction of the further processing paths. After the introduction of the first processing path in a succeeding processing step, the substrate is led to a thermal treatment, where the flow of the individual processing paths changed due to the thermal treatment relative to the reference path is detected by using the sensor and the correction value is determined for all the further processing paths based on the deviation of changed first processing path from the reference path detected by using the sensor. All processing paths are followed up based on the detected flow of the individual of the changed first processing paths. The processing paths are brought in a coating on the glass substrate. The first processing paths and second and optionally further processing paths are introduced parallel to each other. The first processing paths linearly run in a sectionwise manner. The further processing paths run in a curved manner. The respective focal point of the laser beam is adjusted by common laser processing head having focusing optics or single optics. The deviation is continuously or cyclically detected. An edge of the substrate is used as reference path. The processing paths are detected by using the sensor in a contactless manner.
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