Arrangement for electronic component in housing made of plastic, comprises cover and lower piece, where cover is connected with lower piece

The arrangement comprises a cover (3) and a lower piece (4), where the cover is connected with the lower piece. The cover after the connection with the lower piece is connected with an electronic component (1), which is fixed with a predetermined force (F). The force reduction is provided correspond...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WIECZOREK, MATTHIAS, HIRMER, CHRISTIAN, WENK, ALEXANDER, HENNIGER, JUERGEN, KARRER, HELMUT, TRENNER, UWE
Format:	Patent
Sprache:	eng ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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