Method for cooling of substrates in a treatment chamber, comprises subjecting the substrate to a heat treatment, where the substrates are arranged as substrate arrangement on a substrate carrier rotatable around an axis
The method comprises subjecting a substrate (1) to a heat treatment. The substrates are arranged as substrate arrangement (5) on a substrate carrier (4) rotatable around an axis (3). The substrate arrangement is subjected radially external to an axis and in a defined sector with a cooling gas, which...
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| creator | BUSCHBECK, GUNTER STEINBORN, KLAUS-DIETER SOLGER, NORBERT WEISFLOG, JOACHIM UHLIG, SOEREN |
| description | The method comprises subjecting a substrate (1) to a heat treatment. The substrates are arranged as substrate arrangement (5) on a substrate carrier (4) rotatable around an axis (3). The substrate arrangement is subjected radially external to an axis and in a defined sector with a cooling gas, which is led by a circulating pump as cooling gas stream from a side of the defined sector to the opposite side. The cooling gas stream is led from outlet of the defined sector into a gas return chamber. The cooling gas is sucked off from the gas return chamber by the circulating pump. The method comprises subjecting a substrate (1) to a heat treatment. The substrates are arranged as substrate arrangement (5) on a substrate carrier (4) rotatable around an axis (3). The substrate arrangement is subjected radially external to an axis and in a defined sector with a cooling gas, which is led by a circulating pump as cooling gas stream from a side of the defined sector to the opposite side. The cooling gas stream is led from outlet of the defined sector into a gas return chamber. The cooling gas is sucked off from the gas return chamber by the circulating pump. The cooling gas stream is led parallel or radially tangential to the axis over the defined sector. The heat is withdrawn from the cooling gas over the cooling surface to guiding direction, in the gas return chamber and/or over cooling surface in the area of the circulating pump. The cooling gas is swirled to the cooling surface by flow hindrances. The cooling gas stream is portioned in the area of the defined sector by guiding direction in two or more cooling gas streams with same or different flow velocity. An independent claim is included for a device for cooling of substrates in a treatment chamber.
Die Erfindung betrifft ein Verfahren und eine Vorrichtung zum Kühlen von Substraten (1) in einer Behandlungskammer (2), wobei die Substrate (1) auf einem um eine Achse (3) drehbaren Substratträger (4) angeordnet sind. Radial außerhalb und in einem definierten Sektor (14) wird die Substratanordnung (5) mit einem Kühlgas beaufschlagt, wobei das Kühlgas mittels einer Umwälzpumpe (11) als Kühlgasstrom von einer Seite des definierten Sektors (14) zur gegenüberliegenden Seite und in eine Gas-Rückströmkammer (10) geleitet wird. Mindestens außerhalb des definierten Sektors (14) wird dem Kühlgas über Kühlflächen Wärme entzogen. Die Vorrichtung umfasst insbesondere koaxial zur Achse (3) sowie radial außerhalb und parallel zur |
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Die Erfindung betrifft ein Verfahren und eine Vorrichtung zum Kühlen von Substraten (1) in einer Behandlungskammer (2), wobei die Substrate (1) auf einem um eine Achse (3) drehbaren Substratträger (4) angeordnet sind. Radial außerhalb und in einem definierten Sektor (14) wird die Substratanordnung (5) mit einem Kühlgas beaufschlagt, wobei das Kühlgas mittels einer Umwälzpumpe (11) als Kühlgasstrom von einer Seite des definierten Sektors (14) zur gegenüberliegenden Seite und in eine Gas-Rückströmkammer (10) geleitet wird. Mindestens außerhalb des definierten Sektors (14) wird dem Kühlgas über Kühlflächen Wärme entzogen. Die Vorrichtung umfasst insbesondere koaxial zur Achse (3) sowie radial außerhalb und parallel zur Substratanordnung (5) einen Leitschirm (6), derart, dass zwischen der Substratanordnung (5) und dem Leitschirm (6) ein Spalt als Kühlkanal (7) ausgebildet ist. Eine Umwälzpumpe (11) pumpt das Kühlgas aus einer Gas-Rückströmkammer (10) ab und in den Kühlkanal (7) hinein. Mindestens in der Gas-Rückströmkammer (10) sind Kühlflächen (12) vorgesehen.</description><language>eng ; ger</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2009</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090917&DB=EPODOC&CC=DE&NR=102008012931A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090917&DB=EPODOC&CC=DE&NR=102008012931A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BUSCHBECK, GUNTER</creatorcontrib><creatorcontrib>STEINBORN, KLAUS-DIETER</creatorcontrib><creatorcontrib>SOLGER, NORBERT</creatorcontrib><creatorcontrib>WEISFLOG, JOACHIM</creatorcontrib><creatorcontrib>UHLIG, SOEREN</creatorcontrib><title>Method for cooling of substrates in a treatment chamber, comprises subjecting the substrate to a heat treatment, where the substrates are arranged as substrate arrangement on a substrate carrier rotatable around an axis</title><description>The method comprises subjecting a substrate (1) to a heat treatment. The substrates are arranged as substrate arrangement (5) on a substrate carrier (4) rotatable around an axis (3). The substrate arrangement is subjected radially external to an axis and in a defined sector with a cooling gas, which is led by a circulating pump as cooling gas stream from a side of the defined sector to the opposite side. The cooling gas stream is led from outlet of the defined sector into a gas return chamber. The cooling gas is sucked off from the gas return chamber by the circulating pump. The method comprises subjecting a substrate (1) to a heat treatment. The substrates are arranged as substrate arrangement (5) on a substrate carrier (4) rotatable around an axis (3). The substrate arrangement is subjected radially external to an axis and in a defined sector with a cooling gas, which is led by a circulating pump as cooling gas stream from a side of the defined sector to the opposite side. The cooling gas stream is led from outlet of the defined sector into a gas return chamber. The cooling gas is sucked off from the gas return chamber by the circulating pump. The cooling gas stream is led parallel or radially tangential to the axis over the defined sector. The heat is withdrawn from the cooling gas over the cooling surface to guiding direction, in the gas return chamber and/or over cooling surface in the area of the circulating pump. The cooling gas is swirled to the cooling surface by flow hindrances. The cooling gas stream is portioned in the area of the defined sector by guiding direction in two or more cooling gas streams with same or different flow velocity. An independent claim is included for a device for cooling of substrates in a treatment chamber.
Die Erfindung betrifft ein Verfahren und eine Vorrichtung zum Kühlen von Substraten (1) in einer Behandlungskammer (2), wobei die Substrate (1) auf einem um eine Achse (3) drehbaren Substratträger (4) angeordnet sind. Radial außerhalb und in einem definierten Sektor (14) wird die Substratanordnung (5) mit einem Kühlgas beaufschlagt, wobei das Kühlgas mittels einer Umwälzpumpe (11) als Kühlgasstrom von einer Seite des definierten Sektors (14) zur gegenüberliegenden Seite und in eine Gas-Rückströmkammer (10) geleitet wird. Mindestens außerhalb des definierten Sektors (14) wird dem Kühlgas über Kühlflächen Wärme entzogen. Die Vorrichtung umfasst insbesondere koaxial zur Achse (3) sowie radial außerhalb und parallel zur Substratanordnung (5) einen Leitschirm (6), derart, dass zwischen der Substratanordnung (5) und dem Leitschirm (6) ein Spalt als Kühlkanal (7) ausgebildet ist. Eine Umwälzpumpe (11) pumpt das Kühlgas aus einer Gas-Rückströmkammer (10) ab und in den Kühlkanal (7) hinein. Mindestens in der Gas-Rückströmkammer (10) sind Kühlflächen (12) vorgesehen.</description><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2009</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjrFuwlAMRbN0QIV_8NKNSgksMKKWqgsbO3IeDu-h5Dmyjdp_7c_UQUiBjcnS9TnXnhR_O7LIR2hYIDC3KZ-AG9BLrSZopJAyIJgQWkfZIETsapK5010vSZ1w-EzBBtUijS4YuxrdHP05_EQSegQV0CMUwXyiI6DeddzS620eXhlXwXeJBIQNDet2gPmSvcC536TT4qXBVml2m6_F29d2__H9Tj0fSHsMlMkOn9uqXJTlqqwW62W1qZbPcv8Ew202</recordid><startdate>20090917</startdate><enddate>20090917</enddate><creator>BUSCHBECK, GUNTER</creator><creator>STEINBORN, KLAUS-DIETER</creator><creator>SOLGER, NORBERT</creator><creator>WEISFLOG, JOACHIM</creator><creator>UHLIG, SOEREN</creator><scope>EVB</scope></search><sort><creationdate>20090917</creationdate><title>Method for cooling of substrates in a treatment chamber, comprises subjecting the substrate to a heat treatment, where the substrates are arranged as substrate arrangement on a substrate carrier rotatable around an axis</title><author>BUSCHBECK, GUNTER ; STEINBORN, KLAUS-DIETER ; SOLGER, NORBERT ; WEISFLOG, JOACHIM ; UHLIG, SOEREN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_DE102008012931A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; ger</language><creationdate>2009</creationdate><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>BUSCHBECK, GUNTER</creatorcontrib><creatorcontrib>STEINBORN, KLAUS-DIETER</creatorcontrib><creatorcontrib>SOLGER, NORBERT</creatorcontrib><creatorcontrib>WEISFLOG, JOACHIM</creatorcontrib><creatorcontrib>UHLIG, SOEREN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>BUSCHBECK, GUNTER</au><au>STEINBORN, KLAUS-DIETER</au><au>SOLGER, NORBERT</au><au>WEISFLOG, JOACHIM</au><au>UHLIG, SOEREN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method for cooling of substrates in a treatment chamber, comprises subjecting the substrate to a heat treatment, where the substrates are arranged as substrate arrangement on a substrate carrier rotatable around an axis</title><date>2009-09-17</date><risdate>2009</risdate><abstract>The method comprises subjecting a substrate (1) to a heat treatment. The substrates are arranged as substrate arrangement (5) on a substrate carrier (4) rotatable around an axis (3). The substrate arrangement is subjected radially external to an axis and in a defined sector with a cooling gas, which is led by a circulating pump as cooling gas stream from a side of the defined sector to the opposite side. The cooling gas stream is led from outlet of the defined sector into a gas return chamber. The cooling gas is sucked off from the gas return chamber by the circulating pump. The method comprises subjecting a substrate (1) to a heat treatment. The substrates are arranged as substrate arrangement (5) on a substrate carrier (4) rotatable around an axis (3). The substrate arrangement is subjected radially external to an axis and in a defined sector with a cooling gas, which is led by a circulating pump as cooling gas stream from a side of the defined sector to the opposite side. The cooling gas stream is led from outlet of the defined sector into a gas return chamber. The cooling gas is sucked off from the gas return chamber by the circulating pump. The cooling gas stream is led parallel or radially tangential to the axis over the defined sector. The heat is withdrawn from the cooling gas over the cooling surface to guiding direction, in the gas return chamber and/or over cooling surface in the area of the circulating pump. The cooling gas is swirled to the cooling surface by flow hindrances. The cooling gas stream is portioned in the area of the defined sector by guiding direction in two or more cooling gas streams with same or different flow velocity. An independent claim is included for a device for cooling of substrates in a treatment chamber.
Die Erfindung betrifft ein Verfahren und eine Vorrichtung zum Kühlen von Substraten (1) in einer Behandlungskammer (2), wobei die Substrate (1) auf einem um eine Achse (3) drehbaren Substratträger (4) angeordnet sind. Radial außerhalb und in einem definierten Sektor (14) wird die Substratanordnung (5) mit einem Kühlgas beaufschlagt, wobei das Kühlgas mittels einer Umwälzpumpe (11) als Kühlgasstrom von einer Seite des definierten Sektors (14) zur gegenüberliegenden Seite und in eine Gas-Rückströmkammer (10) geleitet wird. Mindestens außerhalb des definierten Sektors (14) wird dem Kühlgas über Kühlflächen Wärme entzogen. Die Vorrichtung umfasst insbesondere koaxial zur Achse (3) sowie radial außerhalb und parallel zur Substratanordnung (5) einen Leitschirm (6), derart, dass zwischen der Substratanordnung (5) und dem Leitschirm (6) ein Spalt als Kühlkanal (7) ausgebildet ist. Eine Umwälzpumpe (11) pumpt das Kühlgas aus einer Gas-Rückströmkammer (10) ab und in den Kühlkanal (7) hinein. Mindestens in der Gas-Rückströmkammer (10) sind Kühlflächen (12) vorgesehen.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | Method for cooling of substrates in a treatment chamber, comprises subjecting the substrate to a heat treatment, where the substrates are arranged as substrate arrangement on a substrate carrier rotatable around an axis |
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