Method for cooling of substrates in a treatment chamber, comprises subjecting the substrate to a heat treatment, where the substrates are arranged as substrate arrangement on a substrate carrier rotatable around an axis

The method comprises subjecting a substrate (1) to a heat treatment. The substrates are arranged as substrate arrangement (5) on a substrate carrier (4) rotatable around an axis (3). The substrate arrangement is subjected radially external to an axis and in a defined sector with a cooling gas, which is led by a circulating pump as cooling gas stream from a side of the defined sector to the opposite side. The cooling gas stream is led from outlet of the defined sector into a gas return chamber. The cooling gas is sucked off from the gas return chamber by the circulating pump. The method comprises subjecting a substrate (1) to a heat treatment. The substrates are arranged as substrate arrangement (5) on a substrate carrier (4) rotatable around an axis (3). The substrate arrangement is subjected radially external to an axis and in a defined sector with a cooling gas, which is led by a circulating pump as cooling gas stream from a side of the defined sector to the opposite side. The cooling gas stream is led from outlet of the defined sector into a gas return chamber. The cooling gas is sucked off from the gas return chamber by the circulating pump. The cooling gas stream is led parallel or radially tangential to the axis over the defined sector. The heat is withdrawn from the cooling gas over the cooling surface to guiding direction, in the gas return chamber and/or over cooling surface in the area of the circulating pump. The cooling gas is swirled to the cooling surface by flow hindrances. The cooling gas stream is portioned in the area of the defined sector by guiding direction in two or more cooling gas streams with same or different flow velocity. An independent claim is included for a device for cooling of substrates in a treatment chamber. Die Erfindung betrifft ein Verfahren und eine Vorrichtung zum Kühlen von Substraten (1) in einer Behandlungskammer (2), wobei die Substrate (1) auf einem um eine Achse (3) drehbaren Substratträger (4) angeordnet sind. Radial außerhalb und in einem definierten Sektor (14) wird die Substratanordnung (5) mit einem Kühlgas beaufschlagt, wobei das Kühlgas mittels einer Umwälzpumpe (11) als Kühlgasstrom von einer Seite des definierten Sektors (14) zur gegenüberliegenden Seite und in eine Gas-Rückströmkammer (10) geleitet wird. Mindestens außerhalb des definierten Sektors (14) wird dem Kühlgas über Kühlflächen Wärme entzogen. Die Vorrichtung umfasst insbesondere koaxial zur Achse (3) sowie radial außerhalb und parallel zur