Anordnung in Druckkontaktierung mit einem Leistungshalbleitermodul
The arrangement has a power semiconductor module (10) with load and auxiliary connections passing through openings at a cover surface of a plastic housing (9) to connect strip conductors with an electrical contact of an external printed circuit board (5). A thermoplastic insulator body (8) surrounds...
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| Format: | Patent |
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| Zusammenfassung: | The arrangement has a power semiconductor module (10) with load and auxiliary connections passing through openings at a cover surface of a plastic housing (9) to connect strip conductors with an electrical contact of an external printed circuit board (5). A thermoplastic insulator body (8) surrounds the module positioned between the board and a cooling body having a fan in an entire volume of the body (8). A low pressure in relation to an ambient pressure exists inside the body (8) forming flush-mounted force fit connections with end surfaces (84, 86) turned to the board and the cooling body. |
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