Verfahren zum Mattierungsätzen von Siliziumsubstraten und Ätzmischung zur Durchführung des Verfahrens

Method for soft etching of silicon substrate using mineral acid mixture, is claimed, where the mineral acid comprises: high concentrated acids such as 96% of sulfuric acid, 70% of nitric acid and 70% of hydrofluoric acid; water-binding agent; and an added fluoride ion containing buffer. An independe...

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Bibliographische Detailangaben
Hauptverfasser:	SPEER, VOLKER, PREISING, HENRI
Format:	Patent
Sprache:	ger
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE
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Beschreibung
Zusammenfassung:	Method for soft etching of silicon substrate using mineral acid mixture, is claimed, where the mineral acid comprises: high concentrated acids such as 96% of sulfuric acid, 70% of nitric acid and 70% of hydrofluoric acid; water-binding agent; and an added fluoride ion containing buffer. An independent claim is included for a kit for soft etching of silicon substrate surface, comprising a mixture of mineral acid, which comprises 96% of sulfuric acid, 70% of nitric acid and 70% of hydrofluoric acid in a ratio of 86:8:6 as aqueous solution, diphosphorus pentoxide and sodium fluoride or ammonium fluoride as solid substance in separate packing.