Electronic packing structure e.g. electronic three dimensional package, for manufacturing e.g. micro electronic, signal contact formed on side of structure connected with contact to form canal between contact and inner switching circuit

The structure has a through hole (306) formed in a filling area that is formed at an electronic element (301). A leading material is filled in the hole to form a signal connection between an upper surface of the filling area and a supporting substrate (320). A signal contact (325) is formed on a sid...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHIANG, KOU-NING, CHOU, CHAN-YEN, YUAN, CHANG-ANN, YEW, MINGIH
Format:	Patent
Sprache:	eng ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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