Verfahren zur Bestimmung geometrischer Parameter eines Wafers und Verwendung des Verfahren bei der optischen Inspektion von Wafern

A method of determining geometric parameters of a wafer ( 16 ) is disclosed. For this purpose, the wafer ( 16 ) is inserted in a wafer holder ( 30 ). The wafer holder ( 30 ) is equipped with at least three mechanical contacting elements ( 22 ). The wafer is in mechanical contact with the contacting...

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Bibliographische Detailangaben
Hauptverfasser:	FRIEDRICH, RALF, IFFLAND, THOMAS, SCHENCK, RENE, SKIERA, DANIEL
Format:	Patent
Sprache:	ger
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MATERIALS THEREFOR MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	A method of determining geometric parameters of a wafer ( 16 ) is disclosed. For this purpose, the wafer ( 16 ) is inserted in a wafer holder ( 30 ). The wafer holder ( 30 ) is equipped with at least three mechanical contacting elements ( 22 ). The wafer is in mechanical contact with the contacting elements ( 22 ). The contacting elements ( 22 ) are distributed on the wafer holder ( 30 ) in such a way that they define a geometric figure which is configured such that the center point ( 40 ) of the wafer ( 16 ) comes to lie within the geometric figure. The position of each contacting element ( 22 ) is determined. Each desired geometric parameter of the wafer ( 16 ) is then calculated from the position of the contacting elements ( 22 ).