Enclosed electronic and/or opto-electronic component producing method, involves separating interconnection substrate along predetermined trace within frame, so that interconnection substrate is divided into individual components

The method involves applying an adhesive layer (12) on a lower side of a frame. A supporting substrate (1) and a cover substrate (4) are assembled on an interconnection substrate (17) such that an upper side (F1) of the substrate (1) and a lower side (F3) of the substrate (4) lie opposite to each ot...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	MUND, DIETRICH
Format:	Patent
Sprache:	eng ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!