Verfahren zur Herstellung mindstens zweier Deckenmodule aus einem Deckenelementfür eine Heiz-/Kühldecke

A ceiling/floor element (1) for a heating/cooling ceiling/floor for cooling rooms has precisely one line element (4) for accommodating a cooling fluid. The line element (4) is arranged in at least one carrier layer (5). At least one insulating layer (7) provides heat-insulating covering of the carri...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KOCH, KLAUS-PAUL, KROEBER, CARSTEN
Format: Patent
Sprache:ger
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Beschreibung
Zusammenfassung:A ceiling/floor element (1) for a heating/cooling ceiling/floor for cooling rooms has precisely one line element (4) for accommodating a cooling fluid. The line element (4) is arranged in at least one carrier layer (5). At least one insulating layer (7) provides heat-insulating covering of the carrier layer (5) on one side. The ceiling/floor element (1) has a plurality of cooling-fluid-line portions, which occupy adjacent surface-area portions (14, 16, 18, 20) of the ceiling/floor element (1). Adjacent cooling-fluid-line portions are connected to one another via peripheral cooling-fluid connecting portions (15, 17, 19, 21). The cooling-fluid connecting portions (15, 17, 19, 21) are arranged such that, in the state in which they connect the cooling-fluid-line portions, they do not project laterally beyond the ceiling/floor element (1). In the region of the cooling-fluid connecting portions (15, 17, 19, 21), the carrier layer (5) has apertures via which the cooling-fluid connecting portions (15, 17, 19, 21) are accessible from the periphery of the ceiling/floor element (1). This provides a ceiling/floor element which is relatively straightforward to handle and, in particular, can be transported and stored with relatively low outlay. It is readily possible for the ceiling/floor element to be subdivided into individual ceiling/floor modules (32).