Kontaktiervorrichtung zum Testen von elektronischen Bauelementen unter bestimmten Temperaturbedingungen

Bei einer Vorrichtung zum Testen von elektronischen Bauelementen unter bestimmten Temperaturbedingungen werden die Kontaktelemente (3) der Kontaktiervorrichtung getrennt von der Temperierung der Bauelemente mittels eines temperierten Fluids temperiert, das der Kontaktiervorrichtung über eine an die Kontaktiervorrichtung angeschlossene Fluidzuführleitung zugeführt wird. In a device for testing electronic components, in particular ICs, under specific temperature conditions, the temperature of the contact elements (3) of the contacting device is controlled separately from the temperature control of the components by means of a temperature-controlled fluid, which is fed to the contacting device via a fluid feed line connected to the contacting device. For this purpose, the contacting device has a plurality of fluid channels (27, 28), which are separate from one another, for targeted feeding of the temperature-controlled fluid to the contact elements (3), wherein the fluid channels (27, 28) comprise grooves which are made in a wall (15) of the contacting device that laterally surrounds the contact elements and are covered by means of a cover part (29, 23).