Sealing layer for an integrated circuit, comprises a hydrophilic region on the side, which is faces towards environment, and hydrophobic region facing away from the environment

The sealing layer for an integrated circuit (20), comprises a hydrophilic region (11) on the side, which is faces the environment and hydrophobic region (10) facing away from the environment. The hydrophilic region is arranged adjacent on the hydrophobic region. The hydrophilic characteristic of the...

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Bibliographische Detailangaben
Hauptverfasser:	NOCKE, KERSTIN, GRAFE, JUERGEN, RAMOS, TERESA, REISS, MARTIN
Format:	Patent
Sprache:	eng ; ger
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CORRECTING FLUIDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES INKS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	The sealing layer for an integrated circuit (20), comprises a hydrophilic region (11) on the side, which is faces the environment and hydrophobic region (10) facing away from the environment. The hydrophilic region is arranged adjacent on the hydrophobic region. The hydrophilic characteristic of the layer decreases based on the side facing towards the environment. The thickness of the layer is more than 100 mm and less than 1 mm. The layer is ductile and liquefiable. Independent claims are included for: (1) housing for an integrated circuit; and (2) a sealing material for the production of a sealing layer. Versiegelungsschicht zum Versiegeln gegenüber einer Umgebung, insbesondere zum Versiegeln einer integrierten Schaltung 20, wobei die Versiegelungsschicht einen hydrophilen Bereich 11 an einer der Umgebung zugewandten Seite und einen hydrophoben Bereich 10 an der der Umgebung abgewandten Seite aufweist.