Kühlanordnung für auf einer Trägerplatte angeordnete elektrische Bauelemente

The circuit arrangement (10) has circuit supporting plate (12) for the wiring of components (20) of the circuit arrangement. The flat side (22) borders directly on the cooling agent passage (24).The cooling agent passage has a heat sink (26) and is coupled thermally with the flat side. The flat side...

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Bibliographische Detailangaben
Hauptverfasser:	SCHUPP, FLORIAN, MEHLER, JOHANNES, KARRER, VOLKER, RENKEN, FOLKER, SMIT, ARNOUD, LICHTINGER, BERNHARD
Format:	Patent
Sprache:	ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The circuit arrangement (10) has circuit supporting plate (12) for the wiring of components (20) of the circuit arrangement. The flat side (22) borders directly on the cooling agent passage (24).The cooling agent passage has a heat sink (26) and is coupled thermally with the flat side. The flat side at the cooling agent passage is formed of a metallic layer, in particular copper layer.