Leistungshalbleitermodul mit Verbindungselementen hoher Stromtragfähigkeit
Power semiconductor module contains base plate or is directly mounted on cooler. Its housing has external coupling element (40) for external connection and insulating substrate (50) with insulating body (54) whose first main surface, away from base plate, carries mutually insulated metal coupling tr...
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| Zusammenfassung: | Power semiconductor module contains base plate or is directly mounted on cooler. Its housing has external coupling element (40) for external connection and insulating substrate (50) with insulating body (54) whose first main surface, away from base plate, carries mutually insulated metal coupling tracks (52). Interconnection details are specified and contain metal shaped body with two support positions with total surface of support positions less than half of covered surface of semiconductor component (56). |
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