Halbleiterbauteil in einem Standardgehäuse und Verfahren zur Herstellung desselben
The device (21) has a standard housing (27) provided with external connectors (1-5) in the form of flat leads. The external connectors are mechanically reinforced for supplying the same voltage or the same signals. The external connectors are arranged and electrically connected to the flat leads (28...
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| Format: | Patent |
| Sprache: | ger |
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| Zusammenfassung: | The device (21) has a standard housing (27) provided with external connectors (1-5) in the form of flat leads. The external connectors are mechanically reinforced for supplying the same voltage or the same signals. The external connectors are arranged and electrically connected to the flat leads (28) provided outside of or within the standard housing. The flat leads are formed with the same thickness as the external connectors. The device may be provided in the form of a power transistor, in which the external connectors serve as the gate, drain and source terminals. An independent claim is included for the power semiconductor device manufacture. |
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