Verfahren zum Prüfen einer Halbleiterprobe mit mehreren Abtastungen

The method involves scanning a semiconductor sample (207) for several times to measure the interesting size of the semiconductor sample. Cross-correlation between the scannings is computed. A respective shift value is determined for every scanning based on the computed cross-correlation. Overlaying...

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Bibliographische Detailangaben
1. Verfasser:	ROBILLARD, QUENTIN DE
Format:	Patent
Sprache:	ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	The method involves scanning a semiconductor sample (207) for several times to measure the interesting size of the semiconductor sample. Cross-correlation between the scannings is computed. A respective shift value is determined for every scanning based on the computed cross-correlation. Overlaying of the scannings is then performed, in which the each scanning is shifted with the loading of the respective shift value. Independent claims are included for the following: (1) Test equipment; and (2) Test arrangement for semiconductor sample.