Locating electronic components on a flexible conductor board, comprises fixing the board to a carrier, applying solder, applying the components and placing the board in an oven

A process for locating components on a flexible conductor board (2) which has conductors and component (5) regions, comprises fixing the board to a carrier (1), applying solder, applying the components, and then carrying out the soldering in an oven. A screen is applied to the conductor board, which...

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Bibliographische Detailangaben
1. Verfasser:	WUNDERLICH, ROLAND
Format:	Patent
Sprache:	eng ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A process for locating components on a flexible conductor board (2) which has conductors and component (5) regions, comprises fixing the board to a carrier (1), applying solder, applying the components, and then carrying out the soldering in an oven. A screen is applied to the conductor board, which has cut outs at the points to be soldered. The board consists of PET. Bei einem Verfahren zur Herstellung einer flexiblen Leiterplatte wird die flexible Leiterplatte auf einem Werkstückträger angebracht und vor dem Lötprozess mit einem Abschirmschild versehen, wobei das Abschirmschild Durchbrüche an denjenigen Stellen aufweist, an welchen die flexible Leiterplatte im Lötprozess gelötet werden soll.