System und Verfahren zum Anbringen elektronischer Komponenten auf flexiblen Substraten

A system and method for reflowing solder to interconnect a plurality of electronic components (24) to a substrate (12) is disclosed. The system includes an oven for preheating the substrate (12) and the plurality of electric components (24) disposed thereon, a supplemental heat source disposed in th...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	BULLOCK, LAWRENCE LERNEL, SINKUNAS, PETER JOSEPH, GOENKA, LAKHI NANDLAL, FUKS, STEPHEN EDWARD, KRAUTHEIM, THOMAS B, FOSTER, RAYMOND ERIC, SCHWEITZER, CHARLES FREDERICK, MILLER, MARK D
Format:	Patent
Sprache:	ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A system and method for reflowing solder to interconnect a plurality of electronic components (24) to a substrate (12) is disclosed. The system includes an oven for preheating the substrate (12) and the plurality of electric components (24) disposed thereon, a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder (72), a pallet (14) for supporting the substrate (12), wherein the pallet (14) has at least one internal cavity (40), and a phase-transition material (42) disposed within the cavity (40) for absorbing heat from the pallet (14).