Halbleitergerät mit nivelliert ausgebildeten Strompfadlängen
An electrode wiring structure is disclosed which realizes a semiconductor apparatus as a power semiconductor module with the current path set as shortest as possible and uniformly. The semiconductor apparatus includes: a plurality of semiconductor devices mounted in one array or more on a substrate;...
Gespeichert in:
1. Verfasser: | |
---|---|
Format: | Patent |
Sprache: | ger |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | An electrode wiring structure is disclosed which realizes a semiconductor apparatus as a power semiconductor module with the current path set as shortest as possible and uniformly. The semiconductor apparatus includes: a plurality of semiconductor devices mounted in one array or more on a substrate; a main current electrode mounted along the array(s) of the semiconductor devices, and commonly connected to each of the plurality of semiconductor devices through the substrate. The substrate is connected to the main current electrode through a plurality of wires arranged along the array(s) at equal or substantially equal distances. |
---|