Elektronische Baugruppe

2.1 For electronic assemblies with at least one component mounted on a support body, the thermal connection thereof to a cooling body arranged on the underside of the support body is to be simplified and improved. 2.2 For this purpose, a thermally conductive, electrically insulating, permanently ela...

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Bibliographische Detailangaben
Hauptverfasser:	WALDAU, IRENEUS, KOLBINGER, MARTIN, HEINZ, HELMUT, TRAGESER, HUBERT, SCHUCH, BERNHARD, SCHNEIDER, JOHANN, BERGHOFF, GERHARD, NEHMEIER, FRIEDRICH
Format:	Patent
Sprache:	ger
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS POLISHES PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	2.1 For electronic assemblies with at least one component mounted on a support body, the thermal connection thereof to a cooling body arranged on the underside of the support body is to be simplified and improved. 2.2 For this purpose, a thermally conductive, electrically insulating, permanently elastic joint layer, which produces an again-releasable joint connection, and which consists of a crosslinked polymeric base substance and at least two filler substances, is arranged between the support body and the cooling body. 2.3 Electronic assembly with joint layer between circuit boards and cooling plates.