Verfahren zur Herstellung einer dreidimensionalen Leiterplatte

An efficient method of manufacturing a three-dimensional printed wiring board is provided in which a conductor foil can be reliably heat-fused to the board at a relatively low temperature and the three-dimensional shape such as convex and concave of a mold can be reproduced precisely with no residual stress.The method comprises the steps of providing a filmy insulator comprising a thermoplastic resin composition containing 65-35 wt % of a polyaryl ketone resin having a crystal-melting peak temperature of 260° C. or over, and 35-65 wt % of an amorphous polyetherimide resin, and having a glass transition temperature as measured when the temperature is increased for differential scanning calorie measurement of 150-230° C. superposing a conductor foil on one or both sides of the filmy insulating member, heat-fusing the conductor foil so that the thermoplastic resin composition will satisfy the relation between the crystal-melting calorie DELTA Hm and the crystallizing calorie DELTA Hc as expressed by the following formula (I), etching the conductor foil to form a conductor circuit, and deforming the printed wiring circuit obtained three-dimensionally.