Optoelectronic component used as an SMD-LED comprises a multilayered base plate, a semiconductor chip with electrical connections and a plastic for encapsulating the base plate and chip

Optoelectronic component comprises a multilayered base plate (10), a semiconductor chip (15) with electrical connections and a plastic for encapsulating the base plate and chip. The chip is contacted with and integrated on the base plate. A boundary surface (18) with delayed creep behavior is formed...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ROTSCH, PETER, EIBNER, WOLFGANG, MAHLKOW, ADRIAN
Format:	Patent
Sprache:	eng ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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