Improved method for mounting chips with protuberances in manufacturing process, for use in microelectronics

The method comprises the following steps: the application of a lower filling (27) on a substrate (22); the turning over of a primary chip (21) so that protuberances face the substrate; the laying of the primary chip on the substrate and the application of pressure and heat to make contact of the chi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	PIN, CHEN HUI, CHENG, CHUANG YUNG, WEN, CHIANG HUA, JUI, CHANG HSUAN, YU, HUANG FU, LE, XIE WAN, MING, CHANG CHUANG, CHANG, TU FENG, CHIEH, HU CHIA, NING, HUANG
Format:	Patent
Sprache:	eng ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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