Oberflächenmontierbares Gehäuse für ein elektronisches Bauelement

A housing for an SMD component has a molded body (1) for accommodating the component (2) and a 'heat slug' (3) joined to the molded body for supplying and removing of thermal energy for melting the solder paste (4). The housing has flow devices which are specifically formed by chamfers/tap...

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Bibliographische Detailangaben
Hauptverfasser:	BERGMANN, ROBERT, WAN, JENNY HONG HENG
Format:	Patent
Sprache:	ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A housing for an SMD component has a molded body (1) for accommodating the component (2) and a 'heat slug' (3) joined to the molded body for supplying and removing of thermal energy for melting the solder paste (4). The housing has flow devices which are specifically formed by chamfers/tapers (11) of the molded body and/or of the 'heat slug' (3).