ADMIXTURE FOR CURRENTLESS COPPER PLATING BATH
The additive is formed by the compounds according to the general formula,where R1 = aliphatic alkyl with 1 to 12 carbons, R2 = H -, Na -, K -, x and y = integral number 1 to 10, which it contains separately or in mixtures. It is applied in the amount of 0.01 to 0.50 grams per 1,000 millilitres of th...
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| creator | KOZIOREK JIRI ,CS ZARUBA JIRI,CS KUHNL ZBYNEK ,CS NOVOTNY MILOS ,CS STEPANEK JOSEF,CS |
| description | The additive is formed by the compounds according to the general formula,where R1 = aliphatic alkyl with 1 to 12 carbons, R2 = H -, Na -, K -, x and y = integral number 1 to 10, which it contains separately or in mixtures. It is applied in the amount of 0.01 to 0.50 grams per 1,000 millilitres of the solution for the electroless elimination of the copper plates on the steel base material. The solution is based on cupric sulphide, sulphur acid, derivates of diaminodiphenylmethane, polyethylene glycols, and anionic tensides, which are prepared by sulphonation of aliphatic alcohols. The efficiency of the additive is further increased by the addition of chloride ions in the form of chlorides of the alkali metals in the amount of 3.0 to 10.0 grams per 1,000 millilitres. It has the ability to refine the microstructure of the eliminated copper and increase its adhesion so that it enables the four-fold to five-fold copper-plated steel wire drawing that is required. |
| format | Patent |
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It is applied in the amount of 0.01 to 0.50 grams per 1,000 millilitres of the solution for the electroless elimination of the copper plates on the steel base material. The solution is based on cupric sulphide, sulphur acid, derivates of diaminodiphenylmethane, polyethylene glycols, and anionic tensides, which are prepared by sulphonation of aliphatic alcohols. The efficiency of the additive is further increased by the addition of chloride ions in the form of chlorides of the alkali metals in the amount of 3.0 to 10.0 grams per 1,000 millilitres. It has the ability to refine the microstructure of the eliminated copper and increase its adhesion so that it enables the four-fold to five-fold copper-plated steel wire drawing that is required.</description><edition>5</edition><language>eng</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>1990</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19901114&DB=EPODOC&CC=CS&NR=271682B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19901114&DB=EPODOC&CC=CS&NR=271682B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KOZIOREK JIRI ,CS</creatorcontrib><creatorcontrib>ZARUBA JIRI,CS</creatorcontrib><creatorcontrib>KUHNL ZBYNEK ,CS</creatorcontrib><creatorcontrib>NOVOTNY MILOS ,CS</creatorcontrib><creatorcontrib>STEPANEK JOSEF,CS</creatorcontrib><title>ADMIXTURE FOR CURRENTLESS COPPER PLATING BATH</title><description>The additive is formed by the compounds according to the general formula,where R1 = aliphatic alkyl with 1 to 12 carbons, R2 = H -, Na -, K -, x and y = integral number 1 to 10, which it contains separately or in mixtures. 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It is applied in the amount of 0.01 to 0.50 grams per 1,000 millilitres of the solution for the electroless elimination of the copper plates on the steel base material. The solution is based on cupric sulphide, sulphur acid, derivates of diaminodiphenylmethane, polyethylene glycols, and anionic tensides, which are prepared by sulphonation of aliphatic alcohols. The efficiency of the additive is further increased by the addition of chloride ions in the form of chlorides of the alkali metals in the amount of 3.0 to 10.0 grams per 1,000 millilitres. It has the ability to refine the microstructure of the eliminated copper and increase its adhesion so that it enables the four-fold to five-fold copper-plated steel wire drawing that is required.</abstract><edition>5</edition><oa>free_for_read</oa></addata></record> |
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| subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | ADMIXTURE FOR CURRENTLESS COPPER PLATING BATH |
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