ADMIXTURE FOR CURRENTLESS COPPER PLATING BATH

The additive is formed by the compounds according to the general formula,where R1 = aliphatic alkyl with 1 to 12 carbons, R2 = H -, Na -, K -, x and y = integral number 1 to 10, which it contains separately or in mixtures. It is applied in the amount of 0.01 to 0.50 grams per 1,000 millilitres of the solution for the electroless elimination of the copper plates on the steel base material. The solution is based on cupric sulphide, sulphur acid, derivates of diaminodiphenylmethane, polyethylene glycols, and anionic tensides, which are prepared by sulphonation of aliphatic alcohols. The efficiency of the additive is further increased by the addition of chloride ions in the form of chlorides of the alkali metals in the amount of 3.0 to 10.0 grams per 1,000 millilitres. It has the ability to refine the microstructure of the eliminated copper and increase its adhesion so that it enables the four-fold to five-fold copper-plated steel wire drawing that is required.