Unit of sealing off separating device for use in liquid heat conducting medium of printed circuit board

Welding off separation device in printing circuit board liquid heat transfer agent, which is characterized in that a temperature controllable heating groove is arranged, the heat transfer agent is contained in the heating groove, a ultrasonic oscillator is arranged on the bottom of the heating groove; the circuit board gripping clamps are hung on front part of rotary arm through gripping arm on the both sides of the heating groove; the end part of the rotary arm is supported on the stationary bracket in hinge method. The utility model provides a printing circuit board welding off separation device which has advantages of lower energy consumption, no harmful gas emission, and high element break off rate, high soldering tin removal rate, low element damage rate, simple structure, and easy implementation.