Stacking structure of module cards

The utility model relates to a stacking structure of module cards, which comprises a base plate, secondary glue, a lower layer chip, a plurality of conducting wires, a sticking agent, an upper layer chip and a glue sealing layer, wherein the base plate is provided with an upper surface and a lower surface, a plurality of first electrodes are formed on the upper surface, the secondary glue is coated on the upper surface, the lower layer chip is arranged on the upper surface and is positioned above the secondary glue, the lower layer chip is electrically connected to the first electrodes of the base plate by the conducting wires, the sticking agent comprises a glue body and filling elements and is coated on the lower layer chip; the upper layer chip is stuck on the lower layer chip through the sticking agent and is isolated with the lower layer chip through the filling elements, the upper layer chip is electrically connected to the first electrodes of the base plate through the conducting wires, the glue sealing layer covers the upper layer chip, the lower layer chip and the conducting wires, wherein the secondary glue is coated on the base plate in a screen printing mode, the filling element of the sticking agent form a spherical shape. The utility model has the advantages that the volume of the module card can be reduced, the manufacture is convenient, the production cost can be reduced and the reliability can be increased.