Grinding cylinder for high-speed crystal edge grinding device

The utility model relates to a crystal grinding edge grinding machine for processing wafers in an electronic element processing industry, particularly a grinding cylinder for a high-speed crystal edge grinding machine. A cylinder body of the grinding cylinder forms a sphere body, and an inner cavity...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	FUZHAN YANG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GRINDING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

container_end_page
container_issue
container_start_page
container_title
container_volume
creator	FUZHAN YANG
description	The utility model relates to a crystal grinding edge grinding machine for processing wafers in an electronic element processing industry, particularly a grinding cylinder for a high-speed crystal edge grinding machine. A cylinder body of the grinding cylinder forms a sphere body, and an inner cavity of the cylinder body is provided with a grinding surface which is a complete inner spherical surface structure. When the grinding cylinder is used for grinding wafers with various models, the wafers can be ground smooth and uniform with reliable angle. Compared with similar products, the stable consistency of the utility model can be enhanced by 30 percents, the working speed can be enhanced by about 20 percents, and the general processing effect can be enhanced by more than 25 percents, so that the utility model basically solves problems existing in the manufacture process of similar products at present.
format	Patent
fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN2758970YY</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN2758970YY</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN2758970YY3</originalsourceid><addsrcrecordid>eNrjZLB1L8rMS8nMS1dIrswBslKLFNLyixQyMtMzdIsLUlNTFJKLKotLEnMUUlPSUxXSYapTUssyk1N5GFjTEnOKU3mhNDeDgptriLOHbmpBfnxqcUFicmpeakm8s5-RuamFpblBZKQxEUoAw2kwOg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Grinding cylinder for high-speed crystal edge grinding device</title><source>esp@cenet</source><creator>FUZHAN YANG</creator><creatorcontrib>FUZHAN YANG</creatorcontrib><description>The utility model relates to a crystal grinding edge grinding machine for processing wafers in an electronic element processing industry, particularly a grinding cylinder for a high-speed crystal edge grinding machine. A cylinder body of the grinding cylinder forms a sphere body, and an inner cavity of the cylinder body is provided with a grinding surface which is a complete inner spherical surface structure. When the grinding cylinder is used for grinding wafers with various models, the wafers can be ground smooth and uniform with reliable angle. Compared with similar products, the stable consistency of the utility model can be enhanced by 30 percents, the working speed can be enhanced by about 20 percents, and the general processing effect can be enhanced by more than 25 percents, so that the utility model basically solves problems existing in the manufacture process of similar products at present.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GRINDING ; PERFORMING OPERATIONS ; POLISHING ; SEMICONDUCTOR DEVICES ; TOOLS FOR GRINDING, BUFFING, OR SHARPENING ; TRANSPORTING</subject><creationdate>2006</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20060215&DB=EPODOC&CC=CN&NR=2758970Y$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20060215&DB=EPODOC&CC=CN&NR=2758970Y$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FUZHAN YANG</creatorcontrib><title>Grinding cylinder for high-speed crystal edge grinding device</title><description>The utility model relates to a crystal grinding edge grinding machine for processing wafers in an electronic element processing industry, particularly a grinding cylinder for a high-speed crystal edge grinding machine. A cylinder body of the grinding cylinder forms a sphere body, and an inner cavity of the cylinder body is provided with a grinding surface which is a complete inner spherical surface structure. When the grinding cylinder is used for grinding wafers with various models, the wafers can be ground smooth and uniform with reliable angle. Compared with similar products, the stable consistency of the utility model can be enhanced by 30 percents, the working speed can be enhanced by about 20 percents, and the general processing effect can be enhanced by more than 25 percents, so that the utility model basically solves problems existing in the manufacture process of similar products at present.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GRINDING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TOOLS FOR GRINDING, BUFFING, OR SHARPENING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2006</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLB1L8rMS8nMS1dIrswBslKLFNLyixQyMtMzdIsLUlNTFJKLKotLEnMUUlPSUxXSYapTUssyk1N5GFjTEnOKU3mhNDeDgptriLOHbmpBfnxqcUFicmpeakm8s5-RuamFpblBZKQxEUoAw2kwOg</recordid><startdate>20060215</startdate><enddate>20060215</enddate><creator>FUZHAN YANG</creator><scope>EVB</scope></search><sort><creationdate>20060215</creationdate><title>Grinding cylinder for high-speed crystal edge grinding device</title><author>FUZHAN YANG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN2758970YY3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2006</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GRINDING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TOOLS FOR GRINDING, BUFFING, OR SHARPENING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>FUZHAN YANG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FUZHAN YANG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Grinding cylinder for high-speed crystal edge grinding device</title><date>2006-02-15</date><risdate>2006</risdate><abstract>The utility model relates to a crystal grinding edge grinding machine for processing wafers in an electronic element processing industry, particularly a grinding cylinder for a high-speed crystal edge grinding machine. A cylinder body of the grinding cylinder forms a sphere body, and an inner cavity of the cylinder body is provided with a grinding surface which is a complete inner spherical surface structure. When the grinding cylinder is used for grinding wafers with various models, the wafers can be ground smooth and uniform with reliable angle. Compared with similar products, the stable consistency of the utility model can be enhanced by 30 percents, the working speed can be enhanced by about 20 percents, and the general processing effect can be enhanced by more than 25 percents, so that the utility model basically solves problems existing in the manufacture process of similar products at present.</abstract><oa>free_for_read</oa></addata></record>
fulltext	fulltext_linktorsrc
identifier
ispartof
issn
language	eng
recordid	cdi_epo_espacenet_CN2758970YY
source	esp@cenet
subjects	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GRINDING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
title	Grinding cylinder for high-speed crystal edge grinding device
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-05T19%3A24%3A54IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=FUZHAN%20YANG&rft.date=2006-02-15&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN2758970YY%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true