Grinding cylinder for high-speed crystal edge grinding device

The utility model relates to a crystal grinding edge grinding machine for processing wafers in an electronic element processing industry, particularly a grinding cylinder for a high-speed crystal edge grinding machine. A cylinder body of the grinding cylinder forms a sphere body, and an inner cavity of the cylinder body is provided with a grinding surface which is a complete inner spherical surface structure. When the grinding cylinder is used for grinding wafers with various models, the wafers can be ground smooth and uniform with reliable angle. Compared with similar products, the stable consistency of the utility model can be enhanced by 30 percents, the working speed can be enhanced by about 20 percents, and the general processing effect can be enhanced by more than 25 percents, so that the utility model basically solves problems existing in the manufacture process of similar products at present.