Minisize semiconductor device packaging low arched lead wires special-purpose press plate

The utility model relates to a minisize semiconductor device packaging low arched lead wires special-purpose press plate, which belongs to the technical field of electronic component packaging. A plurality of parallel long waist shape windows 1 are transversally arranged in the middle of the press p...

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Bibliographische Detailangaben
Hauptverfasser:	MING SHEN, HONGYUE YAN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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