Minisize semiconductor device packaging low arched lead wires special-purpose press plate

The utility model relates to a minisize semiconductor device packaging low arched lead wires special-purpose press plate, which belongs to the technical field of electronic component packaging. A plurality of parallel long waist shape windows 1 are transversally arranged in the middle of the press plate, which is characterized in that the included angles alpha which is the angle of windows, formed by the right and the left parts of the long waist shape windows 1 and the central lines of the windows is 40-50 DEG. In this way, a welding head can run longer distance along the Y direction, as a consequence, the utility model can meet the requirement of minisize device low arched lead wires packaging.