Electronic device with multiple assembling device

An electronic device with multiple assembly objects comprises a shell which provides a placement groove, the placement groove can be used to place objects with different thicknesses selectively, and a plurality of electronic components which are placed in the shell and are operated by the electronic device, and a cover body which is used to cover the placement groove of the shell when the placement groove is loaded with thinner objects, and an assisted seat which is placed in the placement groove to increase the depth of the placement groove when the placement groove is loaded with thicker objects, and a second cover body which is used to cover the placement groove of the shell when the placement groove is loaded with thicker objects, and at least one stopper which is arranged beside the assisted seat and is used to fasten the second cover body. In the process of operating, the assisted seat is placed in the placement groove timely, then the first thinner object or the second thicker object can be chosen and matched, therefore improving the performance of practical replacement and having the effect of convenient operation.