Multiplate plane spherical grid array package body
A multi-slab planar ball grid array package is composed of a chip, a plurality of circuit boards, a plurality of metal wires, a plurality of solder balls and a sealing colloid. The plurality of circuit boards is formed in the same plane. A slit is formed between the adjacent circuit boards for the p...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | A multi-slab planar ball grid array package is composed of a chip, a plurality of circuit boards, a plurality of metal wires, a plurality of solder balls and a sealing colloid. The plurality of circuit boards is formed in the same plane. A slit is formed between the adjacent circuit boards for the passing of metal wires to connect the chip and the circuit boards, which is also for the filling of the sealing colloid. Because the chip is borne through the plurality of circuit boards, the thermal stress caused by the difference in the thermal expansion can be reduced. |
|---|