Stress reduced chip package

A clip package capable of reducing stress mainly comprises a containing body, a carrier plate conglutinated with the containing body and enabling a containing chamber opened upwardly to form between the containing body and the carrier plate. A chip is conglutinated on the carrier plate and is electronically connected with the containing body via a plurality of welding lines. Further, the coefficient of thermal expansion of the chip is similar to that of the carrier body. A covering body covers on the containing body and seals the opening of the containing chamber so as to prevent the chip in the containing chamber from being damaged by outer force or being polluted by foreign materials.