Electronic device
The present disclosure relates to an electronic device comprising: a resin comprising a base material and an additive activatable material within the base material of the resin, the resin comprising: a first surface; a second surface opposite the first surface; and a first side extending from the fi...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The present disclosure relates to an electronic device comprising: a resin comprising a base material and an additive activatable material within the base material of the resin, the resin comprising: a first surface; a second surface opposite the first surface; and a first side extending from the first surface and terminating between the first and second surfaces; a die within the resin, including: a third surface; a fourth surface opposite to the third surface; a second side extending from the first surface to the second surface; and an electrical contact at the first surface of the die; one or more activation and conductive portions of additive activatable material along the second side and the third surface; and one or more conductive layers on the one or more active and conductive portions of the additive activatable material along the second side and the third surface.
本公开涉及一种电子装置,包括:树脂,树脂包括基础材料和在树脂的基础材料内的添加式可激活材料,树脂包括:第一表面;与第一表面相对的第二表面;和第一侧面,其从第一表面延伸并终止于第一和第二表面之间;在树脂内的管芯,包括:第三表面;与第三表面相对的第四表面;第二侧面,其从第一表面 |
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