Ultrathin RGB LED packaging structure with embedded metal circuit

The utility model provides an ultra-thin RGB LED packaging structure embedded with a metal circuit, and effectively solves the problems of insufficient soldering and cold soldering after CSP RGB LEDs in the market are welded. According to the technical scheme provided by the utility model, the wafer fixing structure comprises a substrate, one side surface of the substrate is provided with a recessed bowl cup, and the bowl cup is internally provided with a square through hole used as a wafer fixing area; the metal circuit is composed of a high-position boss SMT bonding pad and a low-position groove chip welding function area lower than the high-position SMT bonding pad, and the SMT bonding pad and the chip welding function area are connected together; a clamping groove which extends into the bowl cup and is matched with the metal circuit is formed in the upper plane of the substrate, and the metal circuit is clamped in the clamping groove. 本实用新型提供一种内嵌金属线路的超薄RGB LED封装结构，有效结局了市场上CSP RGB LED的焊接后虚焊及假焊的问题。本实用新型提供了如