Polishing platform trimming device

The utility model relates to the technical field of silicon wafer polishing, and discloses a polishing platform trimming device, which is characterized in that a detachable upper plate and a detachable lower plate are arranged, so that a brush which is arranged between the upper plate and the lower plate in an embedded manner can be conveniently and quickly detached and replaced, and the manufacturing and maintenance cost of the whole trimming device is effectively reduced; according to the diamond dresser, the chip removal corners are arranged between the brushes, chips on the polishing platform can be swept away more efficiently, the chips cut away by the diamond dresser are brought away from the surface of the platform more quickly through the designed angle in cooperation with the self-rotation speed of the polishing platform, and the time for finishing the platform is saved; and through the arrangement of the mounting holes, the assembled upper plate and lower plate can be conveniently matched and mounte