Micro LED bonding device

The embodiment of the utility model discloses a Micro LED bonding device. The Micro LED bonding device comprises a first working platform, a second working platform and a movable bracket connected with the first working platform and the second working platform, the first working platform is provided with a cleaning unit and an attaching unit; the cleaning unit and the attaching unit are jointly provided with a first bearing table; the second working platform is provided with an FPC switching unit, an intrinsic pressure unit and an impedance testing unit; the FPC switching unit, the intrinsic pressure unit and the impedance test unit are jointly provided with a second bearing table; the Micro LED bonding device is further provided with a pre-pressing unit, and the pre-pressing unit is arranged on the first working platform or the second working platform. Different from an independent functional structure of a single moving platform in the prior art, the multi-stage moving platform provided by the embodiment of