Welding type packaged heat dissipation module

The utility model relates to a welding type packaged heat dissipation module, which is used for carrying out heat dissipation on a plurality of arranged chips. The utility model discloses a fin needle assembly which comprises a base, a cover plate arranged on the base and a plurality of fin needles welded between the base and the cover plate. The base and the cover plate are made of aluminum materials. DBC substrates are arranged at the welding positions of the chips, the chips are welded on the DBC substrates, and the DBC substrates are welded on the base and the cover plate. And the circumferential section of the fin needle is elliptical, and the side wall with a large arc conforms to the flowing direction of the water flow module. According to the module, a single-tube internal insulation mode is adopted, the process of coating heat-conducting silicone grease on two sides is omitted, and the chip is welded to the heat dissipation water channel through secondary reflow, so that the thermal resistance of the