Wafer conveying device of bonding equipment

The utility model relates to the technical field of semiconductor processing, and discloses a wafer conveying device of bonding equipment, which comprises a main body mechanism, a fixing mechanism and a cleaning mechanism, the fixing mechanism is positioned above the main body mechanism, and the cle...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIU LEI, CHEN LINBAO, LIU HUI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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