Wafer conveying device of bonding equipment

The utility model relates to the technical field of semiconductor processing, and discloses a wafer conveying device of bonding equipment, which comprises a main body mechanism, a fixing mechanism and a cleaning mechanism, the fixing mechanism is positioned above the main body mechanism, and the cleaning mechanism is positioned above the main body mechanism. The main body mechanism comprises a bearing bottom plate, hydraulic cylinders, hydraulic push rods, a supporting frame, a conveying belt and supporting legs, the hydraulic cylinders are fixedly installed at the upper end of the bearing bottom plate, the hydraulic cylinders are evenly distributed at the upper end of the bearing bottom plate, and the hydraulic push rods are fixedly installed at the transmission ends of the upper ends of the hydraulic cylinders. According to the wafer conveying device of the bonding equipment, the main body mechanism is installed, so that the adjusting capability of the wafer conveying device is improved, the use height of t