Wafer material conveying device

The utility model belongs to the technical field of wafer material conveying, and particularly relates to a wafer material conveying device. The device comprises a module mounting plate, a feeding and discharging mechanism, a conveying mechanism and a clamping mechanism, wherein the feeding and discharging mechanism, the conveying mechanism and the clamping mechanism are mounted on the module mounting plate; wherein the loading and unloading mechanism is arranged on a storage bin of wafer materials and is used for adjusting the positions of the wafer materials; the clamping mechanism is used for clamping and conveying the wafer material from the storage bin to a to-be-sucked pre-positioning position; the conveying mechanism is used for conveying the wafer material on the pre-positioning station to the machining position and conveying the machined wafer material to the cleaning position. According to the utility model, multi-position conveying of wafer materials is realized through the loading and unloading me