Sensor packaging structure and electronic equipment

The utility model relates to a sensor packaging structure, which is characterized in that an integrated circuit chip and an infrared sensing element are respectively packaged between a first dielectric layer and a first injection molding layer and between a second dielectric layer and a second injection molding layer, so that a traditional packaging shell is omitted, and the thickness of the traditional packaging shell can be at least reduced in the thickness direction. Furthermore, the integrated circuit chip is electrically connected with the infrared sensing element through the first rewiring layer, the second metal column and the second rewiring layer, and the integrated circuit chip is led out through the first rewiring layer, the first metal column and the third rewiring layer. The first metal column can utilize the thicknesses of the first dielectric layer and the first injection molding layer, and the second metal column can utilize the thicknesses of the second dielectric layer and the second injecti