Plug-and-play high-power-density power assembly integrated with radiator

The utility model relates to the technical field of power electronics, in particular to a plug-and-play high-power-density power assembly integrated with a radiator, which comprises a PCB (printed circuit board) substrate. The power device is installed on the back face of the PCB substrate, the power device and the PCB substrate are electrically connected with the ceramic copper-clad substrate, the ceramic copper-clad substrate is a double-face copper-clad substrate, and a copper foil on the extension face of the first side of the ceramic copper-clad substrate is welded to the power device; and the first side extension surface of the radiator is welded with the copper foil of the second side extension surface of the ceramic copper-clad substrate. The power assembly can solve the problems that an existing power module is complex in installation, low in power density and large in thermal resistance. 本实用新型涉及电力电子技术领域，一种集成散热器、即插即用的高功率密度功率组件，包括PCB基板；功率器件，安装在PCB基板的背面，并与所述PCB基板电性连接陶瓷覆铜基板，其为双面覆铜基板，所述陶瓷覆铜基板的第一侧延展面的铜箔与所